Because of the softness of the foam, this pad can be compressed to as little as 3mm with minimum pressure. The harder orange foam interface layer enables holograms and micro-scratches to be polished out efficiently. The life of the pad is sustainably increased due to the innovative sandwich design.
Designed for functionality with intelligent detail - the recessed velour backing enables safe and comfortable polishing in hard-to-access areas while simultaneously preventing damage by the otherwise razor-sharp Velcro face of the back-up disc.
The Black SOFTouch Waffle is a finishing-type pad, suitable for use with medium to finishing compounds and polishes (with the exception of S40).
Suitable for use with dual action (DA) and rotary polishing machines.
Pad cut: Microfine (1/6)
Pad size: 85mm (Small) & 145mm (Medium)
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